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INFORMATION FOR AUTHORS

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  list Invitation to ISSE 2016
  list Call for papers
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IMPORTANT DATES

list Abstract Submission Deadline (extended)

February 8, 2016, REMAINING:


listAbstract Acceptance Notice

March 14, 2016, REMAINING:

 

listEarly Bird Registration Deadline

March 31, 2016, REMAINING:

 

list Full Paper Submission Deadline

April 25, 2016, REMAINING:

 

Invitation to ISSE 2016

 

The 39th International Spring Seminar on Electronics Technology is the premier European forum for the exchange of information between senior and young scientists from academic communities and electronic industries from around the world on topics related to their experimental and theoretical work in the very wide-spread field of electronics and micro/nanoelectronics technology and electronic packaging. The theme of upcoming conference is “Printed electronics and smart textiles”. The first time ever the ISSE Conference wil be held in Pilsen.

In the frame of a unique combination of poster exhibitions, oral paper presentations, and individual meetings senior and junior researchers from all over the world can come together to discuss scientific problems and their teaching experiences as well as plan and organize international cooperations and student exchanges in a convenient and multicultural atmosphere

You are invited to participate in this great occasion for sharing ideas, friendship and culture in the context of traditional Czech hospitality. The 39th ISSE will be organised by the Department of Technologies and Measurement, University of West Bohemia, Czech Republic. The host city of ISSE 2016, Pilsen, is a beautiful town with a long tradition of history, culture and strong ties between scientific engineering and its industrial application.

 

Important dates

Abstract Submission Deadline February 1, 2016
Extended Submission of Abstracts February 8, 2016
Abstract Acceptance Notice March 14, 2016
Early Bird Registration Deadline March 31, 2016
Full Paper Submission Deadline April 25, 2016

 

Topics of Interest

A - New Materials, Components and Processes
B - Thermal Management
C - Advanced Packaging and Interconnection Technologies
D - Testing, Reliability and Quality Management
E - Process Modelling and Simulation
F - Environmental and Ecological Effects in Electronics Technology
G - Nanotechnology, Nanomaterials and Nanoelectronics
H - Signal Integrity and Electromagnetic Compatibility
I - Sensors, Actuators and Microsystems
J - Educational and Information Technologies in Electronics Manufacturing
K - Discrete and Integrated Components

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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